{"id":25855,"date":"2023-04-01T12:59:20","date_gmt":"2023-04-01T12:59:20","guid":{"rendered":"https:\/\/consulting.liesabeths.de\/?page_id=25855"},"modified":"2023-04-05T18:12:30","modified_gmt":"2023-04-05T18:12:30","slug":"engineering-services","status":"publish","type":"page","link":"https:\/\/consulting.liesabeths.de\/index.php\/engineering-services\/","title":{"rendered":"Engineering Services"},"content":{"rendered":"\r\n<div class=\"wp-block-cover alignfull has-background-dim-80 has-ast-global-color-3-background-color has-background-dim\" style=\"min-height: 250px;aspect-ratio:unset;\"><img loading=\"lazy\" decoding=\"async\" width=\"1920\" height=\"1080\" class=\"wp-block-cover__image-background wp-image-25005\" src=\"https:\/\/consulting.liesabeths.de\/wp-content\/uploads\/2018\/12\/about-me-header-free-img-1.jpg\" alt=\"\" data-object-fit=\"cover\" srcset=\"https:\/\/consulting.liesabeths.de\/wp-content\/uploads\/2018\/12\/about-me-header-free-img-1.jpg 1920w, https:\/\/consulting.liesabeths.de\/wp-content\/uploads\/2018\/12\/about-me-header-free-img-1-300x169.jpg 300w, https:\/\/consulting.liesabeths.de\/wp-content\/uploads\/2018\/12\/about-me-header-free-img-1-1024x576.jpg 1024w, https:\/\/consulting.liesabeths.de\/wp-content\/uploads\/2018\/12\/about-me-header-free-img-1-768x432.jpg 768w, https:\/\/consulting.liesabeths.de\/wp-content\/uploads\/2018\/12\/about-me-header-free-img-1-1536x864.jpg 1536w\" sizes=\"auto, (max-width: 1920px) 100vw, 1920px\" \/>\r\n<div>\u00a0<\/div>\r\n<div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\r\n\r\n\r\n<h1 class=\"wp-block-heading\">\u00a0<\/h1>\r\n<h1 class=\"has-text-align-center\">Engineering Services<\/h1>\r\n\r\n\r\n<hr class=\"wp-block-separator aligncenter has-text-color has-background has-white-background-color has-white-color\" \/><\/div>\r\n<\/div>\r\n\r\n<h3>Semiconductors<\/h3>\r\n<ul>\r\n<li>Technology scouting in SiC, GaN and other Wide Band Gap (WBG) material<\/li>\r\n<li>Benchmarking of components<\/li>\r\n<li>Circuit layout consideration<\/li>\r\n<li>Simulation<\/li>\r\n<li>Failure debugging<\/li>\r\n<li>Trainings<\/li>\r\n<\/ul>\r\n<h3>Cooling<\/h3>\r\n<ul>\r\n<li>Market Research of best practice of cooling methodology<\/li>\r\n<\/ul>\r\n<h3><a href=\"https:\/\/consulting.liesabeths.de\/index.php\/partner\/\" target=\"_blank\" rel=\"noopener\">Partner Network<\/a><\/h3>\r\n<p>&nbsp;<\/p>","protected":false},"excerpt":{"rendered":"<p>Semiconductors Technology scouting in SiC, GaN and other Wide Band Gap (WBG) material Benchmarking of components Circuit layout consideration Simulation Failure debugging Trainings Cooling Market Research of best practice of cooling methodology Partner Network &nbsp;<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_uag_custom_page_level_css":"","site-sidebar-layout":"no-sidebar","site-content-layout":"plain-container","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"disabled","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"enabled","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center 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